11 September 2018, India:
Intel has acquired NetSpeed Systems, a San Jose, California-based provider of system-on-chip (SoC) design tools and interconnect fabric intellectual property (IP). The financial details of the transaction has not been disclosed yet.
Jim Keller, Senior Vice President and General Manager of the Silicon Engineering Group at Intel, said, “Intel is designing more products with more specialized features than ever before, which is incredibly exciting for Intel architects and for our customers. The challenge is synthesizing a broader set of IP blocks for optimal performance while reining in design time and cost. NetSpeed’s proven network-on-chip technology addresses this challenge, and we’re excited to now have their IP and expertise in-house.”
Explaining the acquisition, the company said, “As SoCs grow more complex and as new fabrication processes explode the number of design rules, architects are increasingly utilizing front-end tools like NetSpeed’s to automate the design and validation process – saving time and money. NetSpeed’s technology helps architects estimate and optimize SoC performance in advance of manufacturing through a system-level approach, user-driven automation and state-of-the-art algorithms.”
Sundari Mitra, who worked at Intel as a chip designer earlier in her career, said, “Intel has been a great customer of NetSpeed’s, and I’m thrilled to once again be joining the company.”
Sundari Mitra added, “Intel is world class at designing and optimizing the performance of custom silicon at scale. As part of Intel’s Silicon Engineering Group, we’re excited to help invent new products that will be a foundation for computing’s future.”
Intel expects to honor NetSpeed’s existing customer contracts, but NetSpeed will become an internal asset going forward, the company said in a statement.
NetSpeed was founded in 2011. It provides scalable, coherent, network-on-chip (NoC) IP to SoC designers. NetSpeed’s NoC tool automates SoC front-end design and generates programmable, synthesizable high-performance and efficient interconnect fabrics.
(Source – blog, Image – Intel)
