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Home News

Microsoft Unveils Secret HoloLens Processor Specs

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August 23, 2016
in News
Reading Time: 1 min read
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Microsoft Unveils Secret HoloLens Processor Specs

Image : The Register

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HoloLens
Image : The Register

23 August 2016, USA :

Microsoft HoloLens is the world’s first fully self-contained, holographic computer, enabling users to interact with high-definition virtual holograms in the real world.

HoloLens headset is basically a computer that you can wear on your head. It puts a semi-transparent display in front of your face, allowing you to interact with apps and games superimposed on your real-world environment.

The secret sauce of Microsoft HoloLens is its Holographic Processing Unit, a custom chip which allows the device to process and integrate the data streaming from its various sensors and deliver it at a rate its Atom chip can process.

At the Hot Chips conference in California Microsoft devices engineer Nick Baker provided a presentation on exactly what’s inside the HPU and how powerful it is. This turns out to be a TSMC-fabricated 28nm coprocessor that has 24 Tensilica DSP cores. It has around 65 million logic gates, 8MB of SRAM, and an additional layer of 1GB of low-power DDR3 RAM.

The RAM is separate from the Atom Cherry Trail which has its own 1GB. All up this means that the HPU itself can handle around a trillion calculations per second.The power is low too – less than 10W from the power supply to handle gesture and environment sensing, PCIe and standard serial interfaces.

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